Ukumelana nobushushu obuphezulu Ukutshiza iteyiphu yelaphu lokugquma iglasi
Ukutshiza nge-Thermal masking yokutshiza iplasma kunye nezinye iinkqubo kwizixhobo zonyango, ukusika i-silicon wafer kunye nezinye iinkqubo.
1. Kwinkqubo ye-SMT, ucingo lwe-thermocouple luya kuncamatheliswa xa ulinganisa ubushushu be-reflux furnace;
2. Kwinkqubo ye-SMT, isetyenziselwa ukuncamathelisa ibhodi yesekethe eguquguqukayo (FPC) kwi-fixture, ukwenzela ukuba kuqhutywe uluhlu lweenkqubo ezinjengokushicilela, ukupakisha kunye nokuvavanya;
3. Inokuthi ifakwe kwikhebula kwaye isetyenziswe njenge-tape ye-insulating;
4. Inokuthi ifakwe kwikhonkco yokuthabatha izinto ngokuxhoma, ukwenzela ukuba ithathe indawo yentsimbi;
5. Isenokusikwa ibe yiyo nayiphi na enye imilo ngeenjongo ezithile ezikhethekileyo.
Into | Iyunithi | Ixabiso eliMgangatho | Indlela yoVavanyo |
Umbala | Mhlophe | Okubonakalayo | |
Ubukhulu besiseko | mm | 0.205±0.015 | I-ASTM D-3652 |
Ubukhulu obupheleleyo | mm | 0.27±0.020 | I-ASTM D-3652 |
Ukukhupha amandla kwintsimbi | N/25mm | 3.0-6.0 | I-ASTM D-3330 |
Tensile strength | N/10mm | ≥250 | I-ASTM D-3759 |
Elongation | % | ≥5 | I-ASTM D-3759 |
Amandla e-Dielectrical | V | 7000 | I-ASTM D-3759 |
Ubuncinane boMyinge woMyalelo | 200 m2 |
Ixabiso (usd) | 4.5 |
Ukupakisha Iinkcukacha | Ukupakishwa kokuThunyelwa ngaphandle kwesiqhelo |
Supply Ability | 100000m² |
Ukuhanjiswa kwePort | eShanghai |