I-G10 yokugquma i-Epoxy Laminate yeglasi
Ubukhulu obuqhelekileyo: 0.5 ~ 100mm
Ubungakanani obuqhelekileyo: 1020 × 2040mm
Ilaphu lefayibha ye-alkali engenazo iglasi ye-elektroniki ifakwe kwiresin ye-epoxy ephuma kumazwe angaphandle, kwaye yongezwe kunye nezinto ezirhatyaniswayo ezivela kumazwe angaphandle, izinto zokuncamathelisa kunye nezinye izongezo, kwaye zicutshungulwe ngokucinezela okushushu.Ibanga le-Flame retardant UL94-VO ibanga, iipropathi ezilungileyo zomatshini kwiqondo lokushisa eliphezulu, ukusebenza kakuhle kokusebenza kunye nokusebenza kwe-insulation.
Isicelo sebhodi ye-epoxy ye-G10: isetyenziswa njengeendawo ezigqumayo kwizakhiwo zeenjini kunye nezixhobo zombane, ezifana neziqhekeza, iikhabhathi zokutshintsha, iziguquli, iimotor zeDC, ii-AC contactors, izixhobo zombane ezingaqhushumbayo kunye nezinye izixhobo zombane.
| Hayi. | Izinto | Iyunithi | Ixabiso eliMgangatho | Iziphumo zovavanyo |
| 1 | Amandla e-Flexural perpendicular to laminations | MPa | GB/T1303.4-2009 | ≥340 |
| 2 | Ukugoba imodyuli elastiki | MPa | GB/T1303.4-2009 | / |
| 3 | I-Notch Impact amandla ahambelana ne-lamination (ebomvu) | kJ/m2 | GB/T1303.4-2009 | ≥33 |
| 4 | Tensile strength | MPa | GB/T1303.4-2009 | / |
| 5 | Amandla eDielectric perpendicular to laminations (kwioli 20±2℃) | KV/mm | GB/T1303.4-2009 | ≥11.4 |
| 6 | Ukutshatyalaliswa kwamandla ombaneihambelana ne-lamination (kwioli90±2℃) | KV | GB/T1303.4-2009 | ≥35 |
| 7 | 1 MHz ilahleko factor | / | GB/T1303.4-2009 | / |
| 8 | Ukumelana ne-insulation kufakwe emanzini | MΩ | GB/T1303.4-2009 | ≥5x10000 |
| 9 | CTI | / | GB/T 4207-2012 | / |
| 10 | Ukufunxwa kwamanzi | mg | GB/T 1303.4-2009 | ≤27 |
| 11 | Ukuxinana | g/cm3 | GB/T 1303.4-2009 | / |
